Telink Port Completion Date Set For March 31
Melbourne, Feb 15, 2017 AEST (ABN Newswire) - Xped Limited (
ASX:XPE) ("Xped" or "the Company") is pleased to provide an update on the ADRC port to the Telink 8269 chip.
Xped's engineering team is working closely with Telink to finalise the port, allowing both companies to enter a testing, evaluation and debugging phase prior to offering ADRC to Telink's customer base. This is on target for completion by March 31, 2017.
The Telink 8269 chip is targeted toward the extremely low-cost high volume device market. Once the Telink 8269 port is complete Xped will begin another phase of development to port ADRC onto a new, still to be released, Telink chipset built for higher-end devices. In response to Telink's customer's needs Xped will be adding the function of BLE pairing capabilities.
Dr Wenjun Sheng said "I am pleased with the progress that both Xped and Telink engineering departments have made with the shared resourcing provided by both companies. Feedback from Telink clients to date has been extremely positive, we now look forward to setting an official launch post porting completion before the end of the first quarter".
Founder, Executive Director & Head of Engineering John Schultz said: "We are delighted to advise our shareholders that it is firmly on track to complete the ADRC port to the Telink 8269 chip by end of March, allowing Telink and Xped to jointly market to Telink's client base which is forecast to grow to 150 million chipsets in 2017.
About XPED Ltd
XPED Ltd (ASX:XPE) is an Australian Internet of Things (“IoT”) technology business. Xped has developed revolutionary and patent-protected technology that allows any consumer, regardless of their technical capability, to connect, monitor and control devices and appliances found in our everyday environment. Xped provides technology solutions for Smart Home, Smart Building, and Healthcare.
At Xped, we’re Making Technology Easy Again(TM)
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