Powertech Technology Inc.

Powertech Technology Inc. is principally engaged in integrated circuit (IC) assembly and final test businesses. The Company primarily provides thin small-outline package (TSOP) ICs, quad flat no-lead (QFN) package, multi-chip package (MCP), stacked multi chip package (S-MCP), ball grid array (BGA) ICs, as well as and package on package (POP) assembly services, Nand-type data flash assembly and testing services, wafer testing services, double data rate (DDR) series assembly and testing services and controller IC assembly and testing services. The Company distributes its products in the domestic market and to overseas markets, including the rest of Asia, the Americas and Europe.