南通富士通微电子股份有限公司

Nantong Fujitsu Microelectronics Co., Ltd. is principally engaged in the packaging and testing of integrated circuits (ICs). The Company mainly offers dual in line packaging (DIP) series, single in line packaging (SIP) series, small out line packaging (SOP) series, quad flat packaging (QFP) series, small outline transistor packaging (SOT) series, transistor outline packaging (TO) series, quad flat no-lead (QFN) and dual flat no-lead packaging (DFN/QFN) series as well as ball grid array packaging (BGA) series. As of December 31, 2008, the Company had three wholly owned subsidiaries, located in Hong Kong, Nantong, China and Kawasaki, Japan, respectively.